REDMAGIC 12 Pro+ Cooling Architecture Revealed: Featuring RGB Water Cooling, Aerospace Steel Graphene, and Liquid Metal 4.0

Ahead of its official launch scheduled for October 15, REDMAGIC 12 Pro+ has unveiled its advanced cooling architecture. The upcoming flagship mobile device introduces several industry-first thermal management innovations aimed at maintaining peak performance during demanding gaming workloads.

Highlighting the system is the industry's first RGB water-cooling technology, complete with customizable lighting effects. It utilizes an AI server-grade fluorinated liquid routed through a dual-loop channel design that comprehensively covers vital components, including the air duct, chipset, and battery. The setup is powered by an ultra-efficient dual-crystal micro-pump operating at just 20mW while delivering 130kPa of pressure.

For active air cooling, the handset features the next-generation Wind-Riding 5.0 fan, which reaches an industry-leading speed of 25,500 RPM. Engineered with a straight-through air duct to directly dissipate heat from core hot spots, the fan structure also introduces an innovative labyrinth dust-proof design and achieves IPX8 water resistance.

Passive dissipation is powered by the upgraded ICE thermal system. This configuration includes an industry-first embedded composite liquid metal 4.0 layer alongside ultra-thin aerospace-grade steel graphene sheets. In addition, a 4D stepped vapor chamber (VC) with double-sided raised contours provides comprehensive contact with critical heat-generating components.

Beyond its cooling capabilities, the REDMAGIC 12 Pro+ retains an under-display front camera for an unobstructed full-screen experience and is powered by Qualcomm's latest high-end Snapdragon platform. The device is designed to offer the best ergonomics in the brand's history, characterized by a lighter, thinner, narrower, and more rounded chassis.

Browse more REDMAGIC news and smartphones on Heyup, or check the current Tryouts.