Samsung Galaxy Z Flip7 to Get Exynos 2500 Chipset
It remains the case that the Exynos 2500 will probably come too late for use in the Galaxy S25 , but the chipset can be used for other Samsung models. According to new information, South Korea's TheElec has received direct confirmation from a senior Samsung official that the Galaxy Z Flip 7 will be equipped with the Exynos 2500.
In recent years, the company has always relied on Snapdragon processors for these foldable smartphones, but now the cost pressure seems to be so high that the company is making the switch to the in-house chipset.
The use of the Exynos in foldables breaks Qualcomm's previous dominance in this area. Samsung wants to become more independent and establish its own chips more firmly among users. The fact that the Exynos 2500 is being used indicates that Samsung's 3-nm Gate-All-Around (GAA) technology is making progress in the second generation, even if the performance has yet to be verified with the finished devices.
This chipset scores 2,359 and 8,141 points in Geekbench's single and multi-core tests. That is 14% faster than the Exynos 2400 (2,506/6,495) in single-core and 25% faster in multi-core.
Production numbers for foldables with the Exynos 2500 remain low. The manufacturer plans to produce three million units of the Samsung Galaxy Z Flip7, which is only about one percent of the estimated total production of 229.4 million smartphones for 2024. The Flip FE with the Exynos 2400 will even only be produced in a run of 900,000 units. These low numbers show that Samsung is proceeding cautiously while challenges still exist.
Samsung Foundry, the division responsible for chip production, is currently struggling. Its market share has fallen to 9.3 percent, while the Taiwan Semiconductor Manufacturing Company (TSMC) clearly dominates with 64.9 percent. At the same time, the Chinese Semiconductor Manufacturing International Corporation (SMIC) is catching up with six percent. Samsung continues to have problems with low yields in new technologies such as the three-nanometer process and is under strong competitive pressure.
