Moto X70 Air Set for Oct 31 Launch: A Featherlight Powerhouse at 5.3mm Thin

Lenovo has officially announced that its new Moto X70 Air smartphone will be released on October 31 in China, followed by a global debut as the Motorola Edge 70 on November 5. The device is set to impress with a strong focus on an exceptionally slim and lightweight design, featuring a 5.3mm grip thickness and weighing only 159 grams. In a notable move, the phone will also retain a physical SIM card slot with dual SIM, dual standby support.

Moto X70 Air

According to information on the official website, the Moto X70 Air is built with durability in mind. It sports an all-metal frame and boasts both IP68 and IP69 ratings for high-level dust and water resistance. The device also includes Wet Hand Touch 2.0 technology, ensuring the screen remains responsive even when wet. Lenovo claims the phone is engineered to withstand drops from 26 different angles and can resist 28 types of water exposure.

The phone's front features a 1.5K resolution punch-hole display. For photography enthusiasts, it is equipped with a high-resolution 50MP selfie camera and a 50MP main rear camera, promising excellent image quality for both selfies and traditional shots.

Powering the Moto X70 Air is the 4th-generation Qualcomm Snapdragon 7 processor. The device comes with 12GB of RAM and will be available in 256GB and 512GB storage configurations. It is fueled by a 4800mAh battery that supports 68W wired fast charging and 15W wireless charging. Other features include built-in NFC with three-way card swiping capabilities.

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