The Future of Compact Computing: Qualcomm Unveils Ultra-Slim Snapdragon X2 Mini PC Concepts

Qualcomm Unveils Ultra-Slim Snapdragon X2 Mini PC

At the 2025 Snapdragon Summit, Qualcomm showcased a glimpse into the future of compact computing by unveiling two reference designs for mini PCs based on its Snapdragon X2 series Windows on Arm (WoA) processors. Both concepts emphasize a remarkably thin and small form factor.

The first design, seen in the upper left of the image, is a unique disc-shaped device. This mini PC features a rare circular profile and is equipped with three USB-C ports. It supports a single-cable connection to a monitor, seamlessly handling data transfer, video signal, and power delivery for a clean and efficient setup.

The second concept is a square-shaped mini PC designed for modularity. This unit can be slotted into the base of a modular All-in-One (AIO) PC, introducing the innovative concept of replaceable and upgradeable computing hardware for AIO systems.

Qualcomm Unveils Ultra-Slim Snapdragon X2 Mini PC

Qualcomm stated that these reference designs are powered by the 18-core Qualcomm Snapdragon X2 Elite processor and measure an impressive 9.9mm in thickness. To manage thermals within such a slim chassis, the designs utilize Frore Systems' AirJet cooling technology and are currently configured with a 15W TDP.

These two concepts highlight Qualcomm's ambition to push the boundaries of PC design, offering powerful performance in incredibly compact and versatile form factors. The focus on both elegant, minimalist designs and practical modularity suggests a dynamic future for Snapdragon-powered desktop computers.

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