Samsung Ramps Up 2nm Production at Texas Fab, Boosting Capacity to Compete with TSMC

According to a recent report from South Korean media outlet Munhwa Ilbo, Samsung Electronics is aggressively accelerating its advanced process roadmap at its Taylor, Texas wafer fab. The facility is reportedly upgrading its technology focus from the initially planned 4nm to the cutting-edge 2nm process, signaling a major strategic shift to capture leadership in the next generation of semiconductor manufacturing.

In line with this accelerated timeline, the Taylor fab has already placed orders for semiconductor manufacturing equipment compatible with the 2nm process. The first batch of this advanced machinery is scheduled to be installed by March 2026. This sets the stage for the initial manufacturing plan to commence as early as the second quarter of 2026.

The ambitious goal is to achieve full-scale mass production on the 2nm node by 2027. This timeline underscores Samsung's commitment to quickly bring its most advanced technology to the market from its US-based facility, catering directly to the growing demand for high-performance chips in the region.

Significantly, Samsung has also revised its production capacity targets upwards. The fab's initial planned capacity of 20,000 wafers per month (WPM) has been more than doubled to a new target of 50,000 WPM. This substantial increase in output demonstrates Samsung's confidence in securing large-volume orders.

Looking further ahead, the company aims to expand the facility's output to 100,000 WPM by 2027. This strategic expansion is a direct move to compete head-on with industry leader TSMC for advanced process orders. By offering significant production capacity in the United States, Samsung aims to attract major American clients and solidify its position in the global foundry market.

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