Samsung to Debut Advanced HPB Cooling Technology in Exynos 2600 Chip

According to a report from ZDNET Korea, Samsung Electronics is planning to pioneer a new thermal management solution called Heat Path Block (HPB) in its upcoming 2nm flagship mobile platform, the Exynos 2600. This technology is designed to significantly improve heat dissipation directly at the chip package level.

HPB, which stands for Heat Path Block, is described as an ultra-compact, copper-based heat sink. It is engineered to be integrated directly on top of the processor chip as part of the overall package, alongside the LPDDR DRAM memory. This innovative approach tackles heat at its source.

The primary function of HPB is to leverage the superior thermal conductivity of copper. By creating a more efficient channel for heat to escape, the technology helps dissipate thermal energy away from the processor core more effectively. This can lead to sustained performance and better power efficiency, preventing thermal throttling under heavy loads.

2024 Heterogeneous Integration roadmap.

▲ An illustration of HPB technology from Samsung Electronics' 2024 Heterogeneous Integration roadmap.

Samsung is reportedly on a fast track with this technology. The company aims to complete quality testing for the HPB solution on the Exynos 2600 by October of this year. If the development proceeds smoothly, it is expected to enter mass production immediately, making it a strong candidate for inclusion in some models of the Galaxy S26 series.

This development is particularly significant given the history of Samsung's advanced process mobile chips. Previous generations, such as the widely used Qualcomm Snapdragon 888 and 8 Gen 1, which were manufactured by Samsung, faced criticism for issues related to power efficiency and heat generation.

By pairing its next-generation 2nm manufacturing process with the advanced thermal management of HPB technology, Samsung has a clear opportunity to address these past concerns. The Exynos 2600 could potentially reverse the long-standing negative impression of its flagship chips, marking a new era of cool and efficient performance.

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