Sony WF-1000XM6 Teardown Reveals Major Upgrade in Repairability

An early look into the internal structure of Sony's upcoming WF-1000XM6 noise-canceling earbuds has surfaced, thanks to documents disclosed by the Federal Communications Commission (FCC). A recent teardown analysis showcases several key changes, with a significant improvement in repairability being the standout feature.

The most noteworthy adjustment inside the WF-1000XM6 is the elimination of the ribbon cable that previously connected the top cover to the main assembly. This design change is expected to substantially lower the risk of damaging components during battery replacement, making the earbuds more user-serviceable and enhancing their overall repairability.

The teardown images reveal further details, including contacts for the Bluetooth antenna and touch sensor, as well as an opening for the feed-forward microphone. The design features a unique transparent plastic top cover and a flexible PCB with a different color than seen in previous leaks. A MEMS microphone is also visible on the board. Additionally, a production date code of "2521" is visible, suggesting a manufacturing date in the 21st week of 2025.

Regarding the battery, the FCC documents confirm the new model is a Z55FA with a voltage of 3.85V, although its specific capacity remains undisclosed. Sony has listed four potential battery suppliers: Springpower, Highpower/TH, VDL, and Zhuhai ZeniPower Co., Ltd. Based on the "Z" prefix in the model number, ZeniPower is the most likely manufacturer.

On the chipset front, the teardown confirms earlier predictions of an upgraded System-in-Package (SiP). The new model, GSBR-005 (version 3-2), integrates the MT2833 Bluetooth chip. While a resin coating obscures many of the chip details, preventing a direct view of the QN3e noise-canceling chip, component scaling suggests the new QN3e could be twice the size of its predecessor, the QN2e, hinting at a significant performance boost.

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